Matches in SemOpenAlex for { <https://semopenalex.org/work/W2735852034> ?p ?o ?g. }
Showing items 1 to 98 of
98
with 100 items per page.
- W2735852034 abstract "Three-dimensional IC (3D IC) is a promising method to enhance IC performance. Conventional 3D ICs consist of vertically stacked several thin IC chips those are electrically connected with lots of through-Si vias (TSVs) and metal microbumps. Metal microbumps are surrounded by organic adhesive. An epoxy-based material, so-called underfill, has been widely used to fill the gap between several chips. In general, coefficient of thermal expansion (CTE) of the underfill material is larger than that of metal microbumps. This CTE mismatch induces local bending stress in thinned IC chips. This local bending stress would affect CMOS circuit in thinned IC chips. Therefore, we should suppress the local bending stress to realize 3D IC with high reliability. In this work, we propose a novel underfill with negative-CTE filler which can suppress the local bending stress in 3D IC." @default.
- W2735852034 created "2017-07-21" @default.
- W2735852034 creator A5006295728 @default.
- W2735852034 creator A5014073992 @default.
- W2735852034 creator A5036200957 @default.
- W2735852034 date "2016-11-01" @default.
- W2735852034 modified "2023-09-25" @default.
- W2735852034 title "Drastic reduction of keep-out-zone in 3D-IC by local stress suppression with negative-CTE filler" @default.
- W2735852034 cites W1509060557 @default.
- W2735852034 cites W1720247141 @default.
- W2735852034 cites W1979601109 @default.
- W2735852034 cites W2012605786 @default.
- W2735852034 cites W2016172282 @default.
- W2735852034 cites W2019138438 @default.
- W2735852034 cites W2025144218 @default.
- W2735852034 cites W2029558675 @default.
- W2735852034 cites W2045821110 @default.
- W2735852034 cites W2057450859 @default.
- W2735852034 cites W2068391393 @default.
- W2735852034 cites W2092205441 @default.
- W2735852034 cites W2107123813 @default.
- W2735852034 cites W2116759779 @default.
- W2735852034 cites W2134332897 @default.
- W2735852034 cites W2139341438 @default.
- W2735852034 cites W2142901152 @default.
- W2735852034 cites W2151613126 @default.
- W2735852034 cites W2159032199 @default.
- W2735852034 cites W2178969816 @default.
- W2735852034 cites W2471397492 @default.
- W2735852034 doi "https://doi.org/10.1109/3dic.2016.7970031" @default.
- W2735852034 hasPublicationYear "2016" @default.
- W2735852034 type Work @default.
- W2735852034 sameAs 2735852034 @default.
- W2735852034 citedByCount "1" @default.
- W2735852034 countsByYear W27358520342021 @default.
- W2735852034 crossrefType "proceedings-article" @default.
- W2735852034 hasAuthorship W2735852034A5006295728 @default.
- W2735852034 hasAuthorship W2735852034A5014073992 @default.
- W2735852034 hasAuthorship W2735852034A5036200957 @default.
- W2735852034 hasConcept C138885662 @default.
- W2735852034 hasConcept C159985019 @default.
- W2735852034 hasConcept C166595027 @default.
- W2735852034 hasConcept C186260285 @default.
- W2735852034 hasConcept C192562407 @default.
- W2735852034 hasConcept C21036866 @default.
- W2735852034 hasConcept C2779227376 @default.
- W2735852034 hasConcept C41895202 @default.
- W2735852034 hasConcept C46362747 @default.
- W2735852034 hasConcept C47463417 @default.
- W2735852034 hasConcept C49040817 @default.
- W2735852034 hasConcept C530198007 @default.
- W2735852034 hasConcept C59088047 @default.
- W2735852034 hasConcept C68928338 @default.
- W2735852034 hasConcept C79072407 @default.
- W2735852034 hasConcept C87210426 @default.
- W2735852034 hasConceptScore W2735852034C138885662 @default.
- W2735852034 hasConceptScore W2735852034C159985019 @default.
- W2735852034 hasConceptScore W2735852034C166595027 @default.
- W2735852034 hasConceptScore W2735852034C186260285 @default.
- W2735852034 hasConceptScore W2735852034C192562407 @default.
- W2735852034 hasConceptScore W2735852034C21036866 @default.
- W2735852034 hasConceptScore W2735852034C2779227376 @default.
- W2735852034 hasConceptScore W2735852034C41895202 @default.
- W2735852034 hasConceptScore W2735852034C46362747 @default.
- W2735852034 hasConceptScore W2735852034C47463417 @default.
- W2735852034 hasConceptScore W2735852034C49040817 @default.
- W2735852034 hasConceptScore W2735852034C530198007 @default.
- W2735852034 hasConceptScore W2735852034C59088047 @default.
- W2735852034 hasConceptScore W2735852034C68928338 @default.
- W2735852034 hasConceptScore W2735852034C79072407 @default.
- W2735852034 hasConceptScore W2735852034C87210426 @default.
- W2735852034 hasLocation W27358520341 @default.
- W2735852034 hasOpenAccess W2735852034 @default.
- W2735852034 hasPrimaryLocation W27358520341 @default.
- W2735852034 hasRelatedWork W1509060557 @default.
- W2735852034 hasRelatedWork W1918572394 @default.
- W2735852034 hasRelatedWork W1996224802 @default.
- W2735852034 hasRelatedWork W2018480167 @default.
- W2735852034 hasRelatedWork W2123381572 @default.
- W2735852034 hasRelatedWork W2127750043 @default.
- W2735852034 hasRelatedWork W2139351610 @default.
- W2735852034 hasRelatedWork W2148855795 @default.
- W2735852034 hasRelatedWork W2198984399 @default.
- W2735852034 hasRelatedWork W2341148747 @default.
- W2735852034 hasRelatedWork W2542459113 @default.
- W2735852034 hasRelatedWork W2544730300 @default.
- W2735852034 hasRelatedWork W2545408797 @default.
- W2735852034 hasRelatedWork W2565926039 @default.
- W2735852034 hasRelatedWork W2596313691 @default.
- W2735852034 hasRelatedWork W2743366222 @default.
- W2735852034 hasRelatedWork W2743483309 @default.
- W2735852034 hasRelatedWork W2799132179 @default.
- W2735852034 hasRelatedWork W2886835025 @default.
- W2735852034 hasRelatedWork W2467999000 @default.
- W2735852034 isParatext "false" @default.
- W2735852034 isRetracted "false" @default.
- W2735852034 magId "2735852034" @default.
- W2735852034 workType "article" @default.