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• W2738029808 abstract "In this work, the simulating analysis of PoP structure under the temperature range from 0 °C to 125 °C is carried out using direct thermal-cycle analysis and Coffin-Manson method. The results show that the maximum accumulating inelastic hysteresis energy appears on the solder ball in the bottom fine-pitch ball grid array (FBGA) structure. The thermal-fatigue crack initiates in the two symmetrical corners of solder ball in FBGA structure. The thermal-fatigue damage evolves fast in the outer row corner's balls then slowly propagates into the inner row balls in FBGA structure. By analyzing the failure data of solder balls, a thermal-fatigue failure criterion is defined where the critical failure probability value is about 80%." @default.
• W2738029808 created "2017-07-31" @default.
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• W2738029808 date "2017-08-01" @default.
• W2738029808 modified "2023-10-15" @default.
• W2738029808 title "Simulation study on thermo-fatigue failure behavior of solder joints in package-on-package structure" @default.
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• W2738029808 doi "https://doi.org/10.1016/j.microrel.2017.06.033" @default.
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