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• W2741431808 abstract "This paper presents a single-chip 3D electric field microsensor, in which a sensing element is set at the center to detect the Z-axis component of an electrostatic field. Two pairs of sensing elements with the same structure are arranged in a cross-like configuration to measure the X- and Y-axis electrostatic field components. An in-plane rotary mechanism is used in the microsensor to detect the X-, Y-, and Z-axis electrostatic field components simultaneously. The proposed microsensor is compact and presents high integration. The microsensor is fabricated through a MetalMUMPS process. Experimental results show that in the range of 0–50 kV/m, the linearity errors of the microsensor are within 5.5%, and the total measurement errors of the three electrostatic field components are less than 14.04%." @default.
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• W2741431808 date "2017-07-27" @default.
• W2741431808 modified "2023-09-24" @default.
• W2741431808 title "Single-chip 3D electric field microsensor" @default.
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• W2741431808 doi "https://doi.org/10.1007/s11465-017-0454-x" @default.
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