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- W2741831293 abstract "The effects of Fe particles on the viscosity, melting point, microstructure, wettability and mechanical properties of Sn3Ag0.5Cu solder paste were investigated. The results show that the addition of Fe particles with micro size increases the contact area between the solder balls and friction force of solder pastes, which is due to the increasing viscosity of solder paste. The density of Fe is higher than that of the Sn3Ag0.5Cu, and Fe particles are adsorbed to the interface to increase the viscosity of liquid solder, so, the wettability of solder alloys are degraded. Compared with the Sn3Ag0.5Cu/Cu, the fine equiax crystal in Sn3Ag0.5CuFe/Cu is found instead of the bulky βSn arborescent crystal. The shear strength of the Sn3Ag0.5Cu1%Fe/Cu is 46 MPa, which is 39% higher than that of the Sn3Ag0.5Cu/Cu. The microhardness of the matrix increases approximately 25% as a result of incorporation of Fe particles." @default.
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- W2741831293 date "2012-01-01" @default.
- W2741831293 modified "2023-09-27" @default.
- W2741831293 title "Effect of Fe particles on microstructures and properties of Sn3Ag0.5Cu leadfree solder" @default.
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