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- W2742428058 abstract "Over the last years, singulation of thin semiconductor wafers with (ultra) low-k top layer has become a challenge in the production process of integrated circuits. The traditional blade dicing process is encountering serious yield issues. These issues can be addressed by applying a laser grooving process prior to the blade dicing, which is the process of reference nowadays. However, as wafers are becoming thinner, this process flow is not providing the yield and cost required. This paper will discuss the results of a study done on the impact of the dicing quality of thin Si wafers, which led to the development of a laser separation process that employs a V-shape laser beam pattern." @default.
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- W2742428058 date "2017-05-01" @default.
- W2742428058 modified "2023-09-26" @default.
- W2742428058 title "Multi Beam Full Cut Dicing of Thin Si IC Wafers" @default.
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- W2742428058 doi "https://doi.org/10.1109/ectc.2017.81" @default.
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