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- W2742591155 abstract "This paper focuses on evaluating the adhesive strength of Ag-Sn solder-jointed single-crystal silicon (SCS) micro specimens. The exothermic reaction in Al/Ni multilayer film was used as a heat source for melting the solder film. The reaction could generate heat enough to melt Ag-Sn film. To measure the adhesive strength of solder-jointed SCS specimens, we developed the four-point bending tester for minute specimens. The rectangular-solid SCS specimens having a Ag-Sn/AlNi/Ag-Sn multilayered section were prepared by dicing the bonded SCS wafer under various pressure loads in air and vacuum. As a result, fracture strength increased with an increase of pressure load. The strength of specimens bonded in vacuum was higher than that bonded in air." @default.
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- W2742591155 date "2009-01-01" @default.
- W2742591155 modified "2023-09-26" @default.
- W2742591155 title "T0302-1-4 STRENGTH EVALUATION OF AG-SN SOLDER-BONDED MICRO SPECIMEN WITH AL/NI EXOTHERMIC FILM LAYER" @default.
- W2742591155 doi "https://doi.org/10.1299/jsmemecjo.2009.8.0_63" @default.
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