Matches in SemOpenAlex for { <https://semopenalex.org/work/W2743007914> ?p ?o ?g. }
- W2743007914 endingPage "99" @default.
- W2743007914 startingPage "93" @default.
- W2743007914 abstract "The effects of high-temperature aging on a novel hybrid bonding layer were investigated. The hybrid layer, which consisted of Cu nanoparticles and a eutectic Bi-Sn solder powder, was formed by a sintering reaction of the solid-phase Cu nanoparticles and a chemical reaction involving the liquid-phase Bi and Sn in combination. The layer was used to bond a SiC chip to a direct bonded aluminum substrate. A conventional Cu nanoparticle-based bonding layer was also prepared as a reference. Samples with these bonding layers were evaluated using the thermal aging test (225 or 250 °C, 100 h). Bonding strength and synchrotron radiation computed laminography (SRCL) measurements were performed both before and after the thermal aging test. It was observed that thermal aging greatly decreased the bonding strength of the conventional layer. In contrast, the bonding strength of the hybrid layer was reduced only slightly by the thermal aging treatment. SRCL images showed that the conventional layer exhibited numerous cracks, which acted as passages for oxidation. On the other hand, in the hybrid layer, the liquid-phase Bi and Sn densified the Cu sintering phase through the formation of an alloyed Cu-Sn phase. As a result, the hybrid layer contained fewer passages for oxidation as compared to the conventional layer and maintained its bonding strength even against thermal aging. Therefore, the hybrid layer, which is highly stable against thermal aging, will be useful for the high-temperature operation of intelligent power modules." @default.
- W2743007914 created "2017-08-17" @default.
- W2743007914 creator A5006225110 @default.
- W2743007914 creator A5012458529 @default.
- W2743007914 creator A5018939895 @default.
- W2743007914 creator A5024652400 @default.
- W2743007914 creator A5059519594 @default.
- W2743007914 creator A5068189753 @default.
- W2743007914 creator A5089761663 @default.
- W2743007914 date "2017-11-01" @default.
- W2743007914 modified "2023-10-16" @default.
- W2743007914 title "Effects of thermal aging on Cu nanoparticle/Bi-Sn solder hybrid bonding" @default.
- W2743007914 cites W1118111764 @default.
- W2743007914 cites W1887916963 @default.
- W2743007914 cites W1964535485 @default.
- W2743007914 cites W1969609838 @default.
- W2743007914 cites W1981455186 @default.
- W2743007914 cites W1991291493 @default.
- W2743007914 cites W1995877862 @default.
- W2743007914 cites W1999327694 @default.
- W2743007914 cites W2010933240 @default.
- W2743007914 cites W2011840216 @default.
- W2743007914 cites W2018566830 @default.
- W2743007914 cites W2021016072 @default.
- W2743007914 cites W2023774943 @default.
- W2743007914 cites W2026449655 @default.
- W2743007914 cites W2027270689 @default.
- W2743007914 cites W2047112057 @default.
- W2743007914 cites W2063191389 @default.
- W2743007914 cites W2065111765 @default.
- W2743007914 cites W2070478510 @default.
- W2743007914 cites W2071390153 @default.
- W2743007914 cites W2077211400 @default.
- W2743007914 cites W2093697330 @default.
- W2743007914 cites W2112259505 @default.
- W2743007914 cites W2117903407 @default.
- W2743007914 cites W2140571583 @default.
- W2743007914 cites W2238418030 @default.
- W2743007914 cites W2284380755 @default.
- W2743007914 cites W2292878116 @default.
- W2743007914 cites W2302040766 @default.
- W2743007914 cites W2342800092 @default.
- W2743007914 cites W2467364094 @default.
- W2743007914 cites W2486196793 @default.
- W2743007914 cites W2514167366 @default.
- W2743007914 cites W2520183124 @default.
- W2743007914 cites W2591036981 @default.
- W2743007914 cites W2599207921 @default.
- W2743007914 cites W2056177712 @default.
- W2743007914 doi "https://doi.org/10.1016/j.microrel.2017.07.096" @default.
- W2743007914 hasPublicationYear "2017" @default.
- W2743007914 type Work @default.
- W2743007914 sameAs 2743007914 @default.
- W2743007914 citedByCount "8" @default.
- W2743007914 countsByYear W27430079142018 @default.
- W2743007914 countsByYear W27430079142019 @default.
- W2743007914 countsByYear W27430079142020 @default.
- W2743007914 countsByYear W27430079142021 @default.
- W2743007914 countsByYear W27430079142022 @default.
- W2743007914 crossrefType "journal-article" @default.
- W2743007914 hasAuthorship W2743007914A5006225110 @default.
- W2743007914 hasAuthorship W2743007914A5012458529 @default.
- W2743007914 hasAuthorship W2743007914A5018939895 @default.
- W2743007914 hasAuthorship W2743007914A5024652400 @default.
- W2743007914 hasAuthorship W2743007914A5059519594 @default.
- W2743007914 hasAuthorship W2743007914A5068189753 @default.
- W2743007914 hasAuthorship W2743007914A5089761663 @default.
- W2743007914 hasConcept C155672457 @default.
- W2743007914 hasConcept C159985019 @default.
- W2743007914 hasConcept C171250308 @default.
- W2743007914 hasConcept C178790620 @default.
- W2743007914 hasConcept C18168003 @default.
- W2743007914 hasConcept C185592680 @default.
- W2743007914 hasConcept C192562407 @default.
- W2743007914 hasConcept C2777581544 @default.
- W2743007914 hasConcept C2779227376 @default.
- W2743007914 hasConcept C44280652 @default.
- W2743007914 hasConcept C50296614 @default.
- W2743007914 hasConcept C87976508 @default.
- W2743007914 hasConceptScore W2743007914C155672457 @default.
- W2743007914 hasConceptScore W2743007914C159985019 @default.
- W2743007914 hasConceptScore W2743007914C171250308 @default.
- W2743007914 hasConceptScore W2743007914C178790620 @default.
- W2743007914 hasConceptScore W2743007914C18168003 @default.
- W2743007914 hasConceptScore W2743007914C185592680 @default.
- W2743007914 hasConceptScore W2743007914C192562407 @default.
- W2743007914 hasConceptScore W2743007914C2777581544 @default.
- W2743007914 hasConceptScore W2743007914C2779227376 @default.
- W2743007914 hasConceptScore W2743007914C44280652 @default.
- W2743007914 hasConceptScore W2743007914C50296614 @default.
- W2743007914 hasConceptScore W2743007914C87976508 @default.
- W2743007914 hasLocation W27430079141 @default.
- W2743007914 hasOpenAccess W2743007914 @default.
- W2743007914 hasPrimaryLocation W27430079141 @default.
- W2743007914 hasRelatedWork W1839750456 @default.
- W2743007914 hasRelatedWork W2014726310 @default.
- W2743007914 hasRelatedWork W2032839346 @default.
- W2743007914 hasRelatedWork W2046959048 @default.