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• W2743034435 abstract "The introduction of new generation semiconductormaterials into power electronics brings not only performanceimprovements but also technological challenges for the thermalmanagement as the urge for high temperature operating powermodules and packaging systems increases. The limiting factorfor the performance and application range is not anymore thechip temperatures but the restrictions of the state-of-the-artpackaging systems. Especially for high power applications, thetemperatures can rise to more than 200 °C at the interconnectlevel. In this paper, as a contribution towards the aboverequirements, the selective laser melting (SLM) technique hasbeen used to fabricate a heat sink concept which would not befeasible with conventional production techniques. Here thefeasibility of producing a heat sink concept with SLM based onmicro-cooling technology is successfully introduced and thethermal management performance is demonstrated. Theadvantages mainly for the volume and weight reduction alongwith performance improvement are highlighted." @default.
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• W2743034435 date "2017-05-01" @default.
• W2743034435 modified "2023-10-01" @default.
• W2743034435 title "Feasibility Investigations on Selective Laser Melting for the Development of Microchannel Cooling in Power Electronics" @default.
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• W2743034435 doi "https://doi.org/10.1109/ectc.2017.232" @default.
• W2743034435 hasPublicationYear "2017" @default.
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