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• W2743221245 abstract "Silicon nitride (SiN_x) films were deposited on Si substrates at 80℃ by using a catalytic chemical vapor deposition (Cat-CVD) technique to investigate the optimal deposition condition. SiH_4 flow rate was varied from 6 to 18 sccm. It is shown that the stress, Young's modulus, fracture toughness and film composition strongly depend on SiH_4 flow rate. These changes of film properties are related to the gases desorption from growing surface. The amount of the gases desorption reaction depends on deposition rate, that is, the rate of the Si-H insertion reaction. The desorption of hydrogen and ammonia gases from growing surface causes the shrinkage of the film surface, which generates tensile stress. Also, SiN_x films with high hydrogen contents show low stress, low Young's modulus and high fracture toughness." @default.
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• W2743221245 date "2004-01-01" @default.
• W2743221245 modified "2023-09-26" @default.
• W2743221245 title "Control of stress in SiN_x films on Si substrate prepared by Cat-CVD method" @default.
• W2743221245 doi "https://doi.org/10.1299/jsmemecjo.2004.1.0_387" @default.
• W2743221245 hasPublicationYear "2004" @default.
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