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- W2743243003 abstract "Through-silicon via (TSV) induced stress field and device performance variation are investigated using N28 silicon data. Back-end-of-line (BEOL) dielectrics affects the stress field of via-last TSV. Asymmetric keep-out zone (KOZ) is observed, i.e. the absolute value of radial stress (|σr|) is different from that of tangential stress (|σθ|). The physics behind the asymmetry is described. A KOZ model considering the asymmetric stress field is proposed and verified by experiment data." @default.
- W2743243003 created "2017-08-17" @default.
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- W2743243003 date "2016-10-01" @default.
- W2743243003 modified "2023-09-25" @default.
- W2743243003 title "Modeling and simulation of TSV induced keep-out zone using silicon data" @default.
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- W2743243003 doi "https://doi.org/10.1109/icsict.2016.7998912" @default.
- W2743243003 hasPublicationYear "2016" @default.
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