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- W2743252018 abstract "Self-sputtering of copper under high electric fields is considered to contribute to plasma buildup during a vacuum breakdown event frequently observed near metal surfaces, even in ultra high vacuum condition in different electric devices. In this study, by means of molecular dynamics simulations, we analyze the effect of surface temperature and morphology on the yield of self-sputtering of copper with ion energies of 0.1-5 keV. We analyze all three low-index surfaces of Cu, {100}, {110} and {111}, held at different temperatures, 300 K, 500 K and 1200 K. The surface roughness relief is studied by either varying the angle of incidence on flat surfaces, or by using arbitrary roughened surfaces, which result in a more natural distribution of surface relief variations. Our simulations provide detailed characterization of copper self-sputtering with respect to different material temperatures, crystallographic orientations, surface roughness, energies, and angles of ion incidence." @default.
- W2743252018 created "2017-08-17" @default.
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- W2743252018 date "2018-01-01" @default.
- W2743252018 modified "2023-10-11" @default.
- W2743252018 title "Cu self-sputtering MD simulations for 0.1–5 keV ions at elevated temperatures" @default.
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- W2743252018 doi "https://doi.org/10.1016/j.nimb.2017.11.001" @default.
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