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- W2744492382 abstract "This paper describes selected technologies for the 3D integration of MEMS devices. This comprises a Via Last approach for the formation of MEMS TSVs and a Cu based thermo-compression bonding method for the realization of small 3D-WLP devices. Moreover, the Aerosol Jet technique is discussed as method for the final assembly by means of printing conducting lines over 3D topography." @default.
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- W2744492382 date "2016-10-01" @default.
- W2744492382 modified "2023-09-28" @default.
- W2744492382 title "3D integration technologies for MEMS" @default.
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- W2744492382 doi "https://doi.org/10.1109/icsict.2016.7998913" @default.
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