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- W2757139487 abstract "Due to the demands of the market, high density and low profile packaging options of small packaging are continuously developed. As high density packaging technologies such as Molded Underfill (MUF) on flip chip package are usually used due to its simplification of assembly process steps and the saving of the cost. For MUF process, in order to ensure void free package, it is often constructed a vacuum system with distributed vent design and applies materials with fine filler sizes. However, the major quality concerns are severe air void entrapment under the die which is strongly depends on the mold process. Typically, a large design of experiment matrix is used to investigate the void issues, which requires significant time and process resources. Hence, in modern development, simulation tools are getting popular to solve these issues since they can efficiently reduce the design to implementation time, identifying key problems before actual manufacturing." @default.
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- W2757139487 date "2017-08-01" @default.
- W2757139487 modified "2023-09-26" @default.
- W2757139487 title "Void risk prediction for Molded Underfill technology on flip chip packages" @default.
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- W2757139487 doi "https://doi.org/10.1109/icept.2017.8046686" @default.
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