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- W2757822673 abstract "Al/Ni self-propagating nanofoil can be used as a localized and rapid heat source to melt solder and achieve material connection. In this paper, air natural convection, thermal insulation and contacting heat transfer of the bonding process were considered separately to analyze the maximum fusion zone size of Sn solder by FEA model. The simulation works analyzed the temperature field and temperature history of self-propagating reaction of Al/Ni foil with Sn coating. Meanwhile, with the help of the observation of microstructure of tin solder and the temperature measurement data by K-type thermocouple, the finite element model were verified and the cause of different size of grains distribution was analyzed. In addition, preheating temperature and the thickness of Cu or Si substrates were also considered for simulate the maximum thickness of Sn solder layer for soldering process." @default.
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- W2757822673 date "2017-08-01" @default.
- W2757822673 modified "2023-09-23" @default.
- W2757822673 title "The influence of heat transfer boundary conditions on the fusion zone size of Sn solder under localized and rapid heat source" @default.
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- W2757822673 doi "https://doi.org/10.1109/icept.2017.8046603" @default.
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