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- W2765073481 abstract "A simple technique is introduced to compare wafer flatness measured on a non-contact capacitative flatness gauge with flatness reported by a photolithography stepper. Because the capacitive gauge measures a wafer in a mechanically free state, the differences between the two types of wafer data maps represent the sets induced by the stepper. For wafers with large Total Thickness Variations (TTV), the effective stepper flatness comes close to the true metrology flatness. However, on ultra-flat wafers with very low TTVs, the stepper signature becomes more visible, which distorts the true flatness reading. Irregular wafer shape may also affect the flatness reading on the stepper due to imperfection of vacuum chucking." @default.
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- W2765073481 date "1999-01-01" @default.
- W2765073481 modified "2023-09-24" @default.
- W2765073481 title "Wafer mapping for stepper effects characterization" @default.
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