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• W2765522356 abstract "Abstract Delamination at the mold compound and leadframe interface is the most common failure mode observed during processing and qualification of the microelectronic package. Mold compound to leadframe delamination is typically observed after environmental reliability stresses like: moisture preconditioning and reflow, air-to-air thermal cycling, biased highly accelerated stress etc. Leadframe based packages constitutes majority of microelectronic packages that are manufactured today, which makes mold compound/leadframe interface of great interest requiring thorough understanding of the adhesion characteristics and its evolution as a function of reliability stresses. This study used four-point bend testing to evaluate the adhesion strength of commercially available mold compound to bare copper and silver plated copper leadframes exposed to automotive grade environmental stresses. Results show that adhesion of mold compound to silver plated leadframes is significantly lower than adhesion to bare copper leadframes. Results obtained from this study can be used to carefully select the qualification reliability stresses to prevent overstressing the package and causing failures related to wire bond cracking, delamination etc., which have significant time and cost implications. Finite element simulations were also performed to validate the empirical adhesion test results and can be extended to full package level models to enable delamination prediction." @default.
• W2765522356 created "2017-11-10" @default.
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• W2765522356 date "2017-10-01" @default.
• W2765522356 modified "2023-09-26" @default.
• W2765522356 title "Adhesion Characteristics of Epoxy Molding Compound and Copper Leadframe Interface: Impact of Environmental Reliability Stresses" @default.
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• W2765522356 doi "https://doi.org/10.4071/isom-2017-wa53_009" @default.
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