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• W2766173630 abstract "Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source N. Tamura, K. Chen and M. Kunz Advanced Light Source, Lawrence Berkeley Laboratory, 1 Cyclotron Road, Berkeley CA 94720, USA. Abstract Synchrotron polychromatic X-ray microdiffraction is a particularly suitable technique to study in situ the effect of electromigration in metal interconnects as add spatial resolution to grain orientation and strain sensitivity. This technique has been extensively used at the Advanced Light Source to monitor changes in aluminum and copper interconnect test structures while high-density current is passed into them during accelerated tests at elevated temperature. One of the principal findings is the observation of electromigration- induced plasticity in the metal lines that appear during the very early stages of electromigration. In some of the lines, high density of geometrically necessary dislocation are formed leading to additional diffusion paths causing an enhancement of electromigration effect at test temperature. Introduction In situ spatially resolved studies of electromigration (EM) effects on metal interconnect lines have been one of the major projects that have been conducted on the X-ray microdiffraction end station formerly located on the 7.3.3 bending magnet beamline at the Advanced Light Source (ALS). The initial funding of the end-station equipments have indeed been provided by Intel Corporation after the initial successful proof-of- principle microLaue experiments performed using the ALS then newly developed Kirkpatrick-Baez (KB) focusing mirror system [1]. The submicron size white beam spot size obtained by the KB optics allows for precisely measuring crystal orientation of individual grains in encapsulated aluminum interconnects [2]. This was followed by successful collaborations with Lucent Technologies and Advanced Micro Devices. The ability to obtain quantitative information such as crystal orientation and strain/stress at the individual grain level during in-situ tests made white beam X-ray microdiffraction a particularly useful tool to study mechanical properties of materials at this length scale, and make particularly suited to obtain a thorough understanding of EM effects on micron to submicron size buried interconnect structures. Besides the ALS, this type of study has been also carried out independently at the Advanced Photon Source (APS) [3] [4] and at the National Synchrotron Light Source (NSLS) [5]. This paper presents an overview of the principal results obtained from X-ray microdiffraction studies of electromigration effects on aluminum and copper" @default.
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• W2766173630 date "2009-07-27" @default.
• W2766173630 modified "2023-09-23" @default.
• W2766173630 title "Synchrotron X-Ray Microdiffraction Studies of Electromigration in Interconnect lines at the Advanced Light Source - eScholarship" @default.
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