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- W2766645376 endingPage "153" @default.
- W2766645376 startingPage "129" @default.
- W2766645376 abstract "Heat sinks are a kind of heat exchangers used for cooling the electronic devices due to the simplicity of fabrication, low cost, and reliability of heat dissipation. The extended surfaces from the heat sinks are either flat-plate fins or pins fins shapes. In the last decades, intensive attentions were spent on miniaturizing the electronic devices because of the high sophisticated micro- and nano-technology development. But the heat dissipation is still the major problem of enhancing the thermal performance the heat sink. In this article, a comprehensive review is carried out on the methods used for optimizing the hydrothermal design of heat sinks. Therefore, available investigations regarding the passive and active techniques utilized for enhancing the heat removal from heat sinks by modifying either the solid domain or fluid domain are covered. The purpose of this study is to summarize the investigational efforts spent for developing the thermal performance of the heat sinks, limitations, and unsolved proposed solutions." @default.
- W2766645376 created "2017-11-10" @default.
- W2766645376 creator A5022013513 @default.
- W2766645376 creator A5028700717 @default.
- W2766645376 creator A5033457980 @default.
- W2766645376 creator A5091484563 @default.
- W2766645376 date "2018-03-01" @default.
- W2766645376 modified "2023-10-10" @default.
- W2766645376 title "Optimization of thermal design of heat sinks: A review" @default.
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