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- W2767925755 abstract "Fabrication procedure of conductive Cu NP paste using sub-10 nm copper nanoparticles for excellent conductivity without heat treatment." @default.
- W2767925755 created "2017-11-17" @default.
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- W2767925755 date "2017-01-01" @default.
- W2767925755 modified "2023-10-03" @default.
- W2767925755 title "Fabrication of sinter-free conductive Cu paste using sub-10 nm copper nanoparticles" @default.
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