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• W2767980412 abstract "The reliability of a photodiode module intended for operation at 4 K was investigated. Flip-chip bonded photodiodes and an adhesively bonded optical fiber attachment structure were considered. Finite element simulations of the thermomechanical stress were used to evaluate the stresses in different design configurations. Results showed that issues with chip cracking in silicon were eliminated by proper selection of component materials. Photodiode modules survived thermal cycling to 77 K and extended operation in 4 K." @default.
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• W2767980412 date "2018-02-01" @default.
• W2767980412 modified "2023-10-16" @default.
• W2767980412 title "Reliability study of fiber-coupled photodiode module for operation at 4 K" @default.
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• W2767980412 doi "https://doi.org/10.1016/j.microrel.2017.10.034" @default.
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