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- W2768456857 abstract "Sub-micron films deposited on a flexible substrate are now commonly used in electronic industry. The main damaging mode of these systems is a multi-cracking of the film under the action of thermal and mechanical stresses. This multi-cracking phenomenon is described using the coupled criterion based on the simultaneous fulfilment of an energy and a stress criteria. The coupled criterion is implemented in a representative volume element and it allows to decide whether the stress or the energy condition governs the cracking mechanism. It is found that the energy conditions predominates for very thin films whereas the stress condition can take place for thicker films. The initial density of cracks is determined and is in good agreement with the experimental measures. Further subdivisions, when increasing the load, are also predicted. Moreover, under some conditions, a master curve can rule the density of cracks function of the applied strain, showing a good agreement between predictions and experiments for a wide range of film thicknesses." @default.
- W2768456857 created "2017-12-04" @default.
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- W2768456857 date "2017-11-29" @default.
- W2768456857 modified "2023-10-14" @default.
- W2768456857 title "Prediction of multi-cracking in sub-micron films using the coupled criterion" @default.
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- W2768456857 doi "https://doi.org/10.1007/s10704-017-0255-6" @default.
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