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- W2768714841 abstract "Abstract An Sn–Ag–Cu based solder alloy, including Ni, Bi and Sb additives, is investigated in this study under isothermal aging conditions. Shear creep tests are conducted on different aged solder joints with copper substrate, giving the creep resistance evolution with aging time. Microscopy analyses reveal the limited growth of the Cu-rich intermetallic layer due to the Ni content and allow for determination of the time-dependent growth of the Sn-rich intermetallic layer. The aged specimens also exhibit a partial dynamically recrystallized microstructure after creep deformation and a brittle-to-ductile fracture transition is found with occurrence of intergranular cracking in the joint." @default.
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- W2768714841 date "2017-12-18" @default.
- W2768714841 modified "2023-10-18" @default.
- W2768714841 title "Microstructural effects of isothermal aging on a doped SAC solder alloy" @default.
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- W2768714841 doi "https://doi.org/10.3139/146.111578" @default.
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