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- W2774167874 abstract "The effect of 2-thiouracil (I) on the electrodeposition of Cu from acid sulfate bath was studied with ref. to both surface topog. and electrokinetic parameters. The acid Cu bath contained CuSO4.5H2O 0.25, H2SO4 0.1M, and I in varying amts. The amts. of I varied for 10-10 to 10-4mol/L and the surface structure varied accordingly. The overvoltage during deposition from baths contg. I was always less than that of a pure bath at the same c.d. The Tafel relationship was valid at low and moderate concns. of I but at very high concns. it was not valid." @default.
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- W2774167874 date "1981-01-01" @default.
- W2774167874 modified "2023-09-23" @default.
- W2774167874 title "Habit modification caused by 2-thiouracil during the electrodeposition of copper on copper (100) face" @default.
- W2774167874 hasPublicationYear "1981" @default.
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