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• W2775956838 abstract "We proposed combining temporally shaped (double-pulse train) laser pulses with spatially shaped (Bessel beam) laser pulses. By using a temporally shaped femtosecond laser Bessel-beam-assisted chemical etching method, the energy deposition efficiency was improved by adjusting the pulse delay to yield a stronger material modification and, thus, a higher etching depth. The etching depth was enhanced by a factor of 13&#x00A0;using the temporally shaped Bessel beam. The mechanism of etching depth enhancement was elucidated by localized transient-free electrons dynamics-induced structural and morphological changes. Micro-Raman spectroscopy was conducted to verify the structural changes inside the material. This method enables high-throughput, high-aspect-ratio microchannel fabrication in fused silica for potential applications in microfluidics." @default.
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• W2775956838 date "2017-12-22" @default.
• W2775956838 modified "2023-10-16" @default.
• W2775956838 title "High-throughput microchannel fabrication in fused silica by temporally shaped femtosecond laser Bessel-beam-assisted chemical etching" @default.
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• W2775956838 doi "https://doi.org/10.1364/ol.43.000098" @default.
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