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• W2778646525 endingPage "131" @default.
• W2778646525 startingPage "123" @default.
• W2778646525 abstract "This study is for fan-out wafer-level packaging with chip-first (die face-up) formation. Chips with Cu contact-pads on the front side and a die attach film on the backside are picked and placed face-up on a temporary-glass-wafer carrier with a thin layer of light-to-heat conversion material. It is followed by compression molding with an epoxy molding compound (EMC) and a post-mold cure on the reconstituted wafer carrier and then backgrinding the molded EMC to expose the Cu contact-pads of the chips. The next step is to build up the redistribution layers (RDLs) from the Cu contact-pads and then mount the solder balls. This is followed by the debonding of the carrier with a laser and then the dicing of the whole reconstituted wafer into individual packages. A 300-mm reconstituted wafer with a package/die ratio = 1.8 and a die-top EMC cap = 100 μm has also been fabricated (a total of 325 test packages on the reconstituted wafer). This test package has three RDLs; the line width/spacing of the first RDL is 5 μm/5 μm, of the second RDL is 10 μm/10 μm, and of the third RDL is 15 μm/15 μm. The dielectric layer of the RDLs is fabricated with a photosensitive polyimide and the conductor layer of the RDLs is fabricated by electrochemical Cu deposition (ECD)." @default.
• W2778646525 created "2018-01-05" @default.
• W2778646525 creator A5000222202 @default.
• W2778646525 creator A5009484220 @default.
• W2778646525 creator A5016536482 @default.
• W2778646525 creator A5017373010 @default.
• W2778646525 creator A5019367836 @default.
• W2778646525 creator A5024336810 @default.
• W2778646525 creator A5025936411 @default.
• W2778646525 creator A5030466622 @default.
• W2778646525 creator A5031078607 @default.
• W2778646525 creator A5037209728 @default.
• W2778646525 creator A5038516431 @default.
• W2778646525 creator A5041920021 @default.
• W2778646525 creator A5043526217 @default.
• W2778646525 creator A5049713089 @default.
• W2778646525 creator A5050829175 @default.
• W2778646525 creator A5051008490 @default.
• W2778646525 creator A5059122502 @default.
• W2778646525 creator A5061913080 @default.
• W2778646525 creator A5063496433 @default.
• W2778646525 creator A5064600890 @default.
• W2778646525 creator A5066846844 @default.
• W2778646525 creator A5067338175 @default.
• W2778646525 creator A5082664972 @default.
• W2778646525 creator A5084843301 @default.
• W2778646525 creator A5087049525 @default.
• W2778646525 creator A5088958907 @default.
• W2778646525 date "2017-10-01" @default.
• W2778646525 modified "2023-09-29" @default.
• W2778646525 title "Fan-Out Wafer-Level Packaging (FOWLP) of Large Chip with Multiple Redistribution Layers (RDLs)" @default.
• W2778646525 cites W1965560269 @default.
• W2778646525 cites W2001039607 @default.
• W2778646525 cites W2001945326 @default.
• W2778646525 cites W2065652267 @default.
• W2778646525 cites W2072078440 @default.
• W2778646525 cites W2110445684 @default.
• W2778646525 cites W2144114410 @default.
• W2778646525 cites W2162289773 @default.
• W2778646525 cites W2511558441 @default.
• W2778646525 cites W2515277349 @default.
• W2778646525 cites W2552566099 @default.
• W2778646525 cites W2735326361 @default.
• W2778646525 cites W2743598307 @default.
• W2778646525 cites W2743599321 @default.
• W2778646525 cites W3037176420 @default.
• W2778646525 cites W1545641439 @default.
• W2778646525 cites W2278961899 @default.
• W2778646525 doi "https://doi.org/10.4071/imaps.522798" @default.
• W2778646525 hasPublicationYear "2017" @default.
• W2778646525 type Work @default.
• W2778646525 sameAs 2778646525 @default.
• W2778646525 citedByCount "27" @default.
• W2778646525 countsByYear W27786465252018 @default.
• W2778646525 countsByYear W27786465252019 @default.
• W2778646525 countsByYear W27786465252020 @default.
• W2778646525 countsByYear W27786465252022 @default.
• W2778646525 countsByYear W27786465252023 @default.
• W2778646525 crossrefType "journal-article" @default.
• W2778646525 hasAuthorship W2778646525A5000222202 @default.
• W2778646525 hasAuthorship W2778646525A5009484220 @default.
• W2778646525 hasAuthorship W2778646525A5016536482 @default.
• W2778646525 hasAuthorship W2778646525A5017373010 @default.
• W2778646525 hasAuthorship W2778646525A5019367836 @default.
• W2778646525 hasAuthorship W2778646525A5024336810 @default.
• W2778646525 hasAuthorship W2778646525A5025936411 @default.
• W2778646525 hasAuthorship W2778646525A5030466622 @default.
• W2778646525 hasAuthorship W2778646525A5031078607 @default.
• W2778646525 hasAuthorship W2778646525A5037209728 @default.
• W2778646525 hasAuthorship W2778646525A5038516431 @default.
• W2778646525 hasAuthorship W2778646525A5041920021 @default.
• W2778646525 hasAuthorship W2778646525A5043526217 @default.
• W2778646525 hasAuthorship W2778646525A5049713089 @default.
• W2778646525 hasAuthorship W2778646525A5050829175 @default.
• W2778646525 hasAuthorship W2778646525A5051008490 @default.
• W2778646525 hasAuthorship W2778646525A5059122502 @default.
• W2778646525 hasAuthorship W2778646525A5061913080 @default.
• W2778646525 hasAuthorship W2778646525A5063496433 @default.
• W2778646525 hasAuthorship W2778646525A5064600890 @default.
• W2778646525 hasAuthorship W2778646525A5066846844 @default.
• W2778646525 hasAuthorship W2778646525A5067338175 @default.
• W2778646525 hasAuthorship W2778646525A5082664972 @default.
• W2778646525 hasAuthorship W2778646525A5084843301 @default.
• W2778646525 hasAuthorship W2778646525A5087049525 @default.
• W2778646525 hasAuthorship W2778646525A5088958907 @default.
• W2778646525 hasConcept C111106434 @default.
• W2778646525 hasConcept C159985019 @default.
• W2778646525 hasConcept C160671074 @default.
• W2778646525 hasConcept C165013422 @default.
• W2778646525 hasConcept C171250308 @default.
• W2778646525 hasConcept C192562407 @default.
• W2778646525 hasConcept C2780288131 @default.
• W2778646525 hasConcept C49040817 @default.
• W2778646525 hasConcept C67558686 @default.
• W2778646525 hasConceptScore W2778646525C111106434 @default.
• W2778646525 hasConceptScore W2778646525C159985019 @default.
• W2778646525 hasConceptScore W2778646525C160671074 @default.
• W2778646525 hasConceptScore W2778646525C165013422 @default.

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