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- W2783016595 abstract "We present a mask-aligner lithographic system operated with a frequency-quadrupled continuous-wave diode laser emitting at 193 nm. For this purpose, a 772 nm diode laser is amplified by a tapered amplifier in the master-oscillator power-amplifier configuration. The emission wavelength is upconverted twice, using LBO and KBBF nonlinear crystals in second-harmonic generation enhancement cavities. An optical output power of 10 mW is achieved. As uniform exposure field illumination is crucial in mask-aligner lithography, beam shaping is realized with optical elements made from fused silica and CaF2 featuring a diffractive non-imaging homogenizer. A tandem setup of shaped random diffusers, one static and one rotating, is used to control speckle formation. We demonstrate first experimental soft contact and proximity prints for a field size of 1 cm2 with a standard binary photomask and proximity prints with a two-level phase mask, both printed into 120 nm layers of photoresist on unstructured silicon substrates." @default.
- W2783016595 created "2018-01-26" @default.
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- W2783016595 date "2018-01-09" @default.
- W2783016595 modified "2023-09-26" @default.
- W2783016595 title "Mask-aligner lithography using a continuous-wave diode laser frequency-quadrupled to 193 nm" @default.
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- W2783016595 doi "https://doi.org/10.1364/oe.26.000730" @default.
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