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• W2783138343 abstract "The thermal management of light-emitting diode (LED) packaging modules has become more important in the past decade, especially for high-powered LED chips, which produce high temperatures during lighting, resulting in luminance decay and color temperature drift. For this issue, this paper presents a novel design of a silicon-based LED packaging module with an integrated capacitive temperature sensor. The technology utilizes the surface micromachining process to fabricate the capacitive temperature sensor with Metal-Insulator-Metal structure on silicon substrate. The LED die is directly mounted on top of sensor and the driving pads are connected with LED die by wire bounding. For this approach, the junction temperature is measured by the variation of capacitance. The typical fabrication result shows that the thickness and area of TiO 2 layer between the electrodes is 80 nm and approximately 2 × 2 mm2, respectively. For such the temperature variations between 25 and 100 °C, a high sensitivity measurement of 0.23 nF/°C is obtained and good linear output is achieved. A miniaturized, integrated, low-cost smart LED packaging module was implemented using this copackaging method." @default.
• W2783138343 created "2018-01-26" @default.
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• W2783138343 date "2017-10-01" @default.
• W2783138343 modified "2023-09-22" @default.
• W2783138343 title "Silicon-based LED packaging module with a TiO<inf>2</inf> capacitive temperature sensor" @default.
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• W2783138343 doi "https://doi.org/10.1109/impact.2017.8255952" @default.
• W2783138343 hasPublicationYear "2017" @default.
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