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• W2783287414 abstract "Laser peeling is an efficient method for removing edge defects on ultra-thin glass for enabling the subsequent roll-to-roll glass processing for display applications. This process involves complicated interaction in various fields such as heat transfer, stress, fracture, and material properties variations. In order to guide the process design for optimizing the laser peeling process, it is important to conduct necessary analyses. In this work, the laser peeling process is modelled as a moving heat source and the corresponding heat transfer, thermal stress, and crack propagation are then simulated. Problems observed during experiments are firstly explained based on simulation results. Finally, essential parametric studied are also performed for providing recommendation for process optimization." @default.
• W2783287414 created "2018-01-26" @default.
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• W2783287414 date "2016-05-01" @default.
• W2783287414 modified "2023-09-23" @default.
• W2783287414 title "Thermo-mechanical analysis of laser peeling of ultrathin glass for removing edge flaws in web processing applications" @default.
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• W2783287414 doi "https://doi.org/10.1109/dtip.2016.7514879" @default.
• W2783287414 hasPublicationYear "2016" @default.
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