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• W2783449274 abstract "In high performance circuit design, thermal effect on electromigration (EM) reliability has become a recent major research for being a limiting factor. In this paper, we propose a novel analytic method to calculate the stress evolution considering time-varying temperature effects during the void nucleation phase for multi-branch interconnect trees, including the straight-line three-terminal wires, the T-shaped four-terminal wires and the cross-shaped five-terminal wires. The proposed closed-form expression can be used to calculate the hydrostatic stress evolution with time-varying temperature. Experiment results show that the obtained analytic solutions match well with the numerical results calculated using COMSOL and thus the proposed models can be used in traditional EM reliability analysis tools." @default.
• W2783449274 created "2018-01-26" @default.
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• W2783449274 date "2017-10-01" @default.
• W2783449274 modified "2023-09-25" @default.
• W2783449274 title "Dynamic temperature-aware reliability modeling for multi-branch interconnect trees" @default.
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• W2783449274 doi "https://doi.org/10.1109/asicon.2017.8252419" @default.
• W2783449274 hasPublicationYear "2017" @default.
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