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• W2789464418 endingPage "012063" @default.
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• W2789464418 abstract "In order to reduce the Tin (Sn) whisker growth phenomenon in solder alloys, the researcher all the world has studied the factor of this behaviour. However, this phenomenon still hunted the electronic devices and industries. The whiskers growth were able to cause the electrical short, which would lead to the catastrophic such as plane crush, the failure of heart pacemaker, and the lost satellite connection. This article focuses on the three factors that influence the whiskers growth in solder alloys which is stress, oxidation layer and temperature. This findings were allowed the researchers to develop various method on how to reduce the growth of the Sn whiskers." @default.
• W2789464418 created "2018-03-29" @default.
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• W2789464418 date "2018-03-19" @default.
• W2789464418 modified "2023-09-22" @default.
• W2789464418 title "The Effects of Oxidation Layer, Temperature, and Stress on Tin Whisker Growth: A Short Review" @default.
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• W2789464418 doi "https://doi.org/10.1088/1757-899x/318/1/012063" @default.
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