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• W2790593195 abstract "We review the hybrid-integration of an InP semiconductor optical amplifier on a silicon photonics chip, and our in-line SOA integration using precise flip-chip bonding technology. We demonstrate the loss-less operation of a 4×4 switch with a 4ch-SOA array." @default.
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• W2790593195 date "2018-01-01" @default.
• W2790593195 modified "2023-09-26" @default.
• W2790593195 title "In-line Optical Amplification for Silicon Photonics Platform by Flip-Chip Bonded InP-SOAs" @default.
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• W2790593195 doi "https://doi.org/10.1364/ofc.2018.tu2a.4" @default.
• W2790593195 hasPublicationYear "2018" @default.
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