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• W2793598030 endingPage "021517" @default.
• W2793598030 startingPage "021517" @default.
• W2793598030 abstract "The coefficient of thermal expansion (α) and biaxial Young's modulus is determined by comparing the differential thermal stress induced in Si-rich silicon nitride thin films deposited on single-crystal Si and sapphire substrates. The amorphous films are deposited in mixtures of dichlorosilane and ammonia, by low pressure chemical vapor deposition, in a temperature range of 1050–1115 K. Temperature-dependent wafer curvature measurements are performed to determine the differential thermal stress, across a temperature range spanning 300–800 K. Observations indicate that both α and the biaxial modulus decrease as the silicon content in the films increases. The trend of reduction in α is consistent with the relative α values for the limiting-case compositions of cubic-Si3N4 and amorphous Si. The decrease in α is attributed to a reduction in anharmonicity associated with Si–Si bonds relative to Si–N bonds. The biaxial modulus is observed to be proportional to the inverse cube root of the amorphous Si volume fraction. This observation is shown to be consistent with volumetric dilation of basal Si-SiyN4-y tetrahedra (y = 0–4), when substoichiometric films are formed through the substitution of Si for N. Additionally, the intrinsic film stress is observed to vary in proportion to the square of the inverse cube root of the amorphous Si volume fraction, which is shown to be consistent with compositionally induced intrinsic strain variation in Si-rich silicon nitride thin films." @default.
• W2793598030 created "2018-03-29" @default.
• W2793598030 creator A5085081246 @default.
• W2793598030 date "2018-03-01" @default.
• W2793598030 modified "2023-09-24" @default.
• W2793598030 title "Coefficient of thermal expansion and biaxial Young's modulus in Si-rich silicon nitride thin films" @default.
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• W2793598030 doi "https://doi.org/10.1116/1.5020432" @default.
• W2793598030 hasPublicationYear "2018" @default.
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