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• W2794937336 abstract "Cu/Ti joints are expected to be used in various applications, while reliable joining method is still to be developed. It is commonly not possible to solder Ti alloys using Sn-based solder alloys because of their poor wettability. In this study, Sn-Ag-Cu soldering filler metal was used to joining TC4 titanium alloy and pure copper using ultrasonic-assisted soldering. The influence of different temperature and different ultrasonic time on the welded joint is studied and explored. Microstructure of the joints was investigated. Shear strength of the joints reached the maximum value, i.e. 38.2MPa. Relationship between the sonication parameters and the microstructure and strength of the joints was discussed. Thus, it is verified that dissimilar metal brazing of TC4 and copper is suitable for low temperature soldering." @default.
• W2794937336 created "2018-04-06" @default.
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• W2794937336 date "2018-03-01" @default.
• W2794937336 modified "2023-09-22" @default.
• W2794937336 title "Ultrasonic-assisted soldering of Cu/Ti joints" @default.
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• W2794937336 doi "https://doi.org/10.1088/1757-899x/322/2/022020" @default.
• W2794937336 hasPublicationYear "2018" @default.
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