Matches in SemOpenAlex for { <https://semopenalex.org/work/W2796156700> ?p ?o ?g. }
Showing items 1 to 80 of
80
with 100 items per page.
- W2796156700 endingPage "718" @default.
- W2796156700 startingPage "711" @default.
- W2796156700 abstract "After an introduction to 3-D technology, and through silicon via (TSV)- and stacking options, this paper provides an overview of failures that can be expected in 3-D technology and lists the potential failure analysis (FA) techniques that can be applied to find these failures and the related challenges. Various failure mechanisms and effects that can be expected in TSVs, such as Cu pumping, voids, liner/barrier breakdown, electromigration, mechanical stress impact, Cu diffusion, plasma-induced damage, and the keep-out-zone, are discussed. Also, failures due to backside processing (thinning-induced damage, charging, and Cu exposure) and stacking (misalignment, voids, solder squeeze-out, electrostatic discharge, stress-induced cracking, and delamination) are listed. The importance of mechanical stress and chip–package interaction as a main threat for failures in 3-D technology is highlighted. The FA techniques are not discussed in detail (references are provided). There is a clear need for techniques that can detect failures, such as small (micrometer and submicrometer range) cracks, voids, and delaminated regions (both planar and vertical)." @default.
- W2796156700 created "2018-04-13" @default.
- W2796156700 creator A5051712390 @default.
- W2796156700 creator A5073310038 @default.
- W2796156700 creator A5080591280 @default.
- W2796156700 date "2018-05-01" @default.
- W2796156700 modified "2023-10-17" @default.
- W2796156700 title "Expected Failures in 3-D Technology and Related Failure Analysis Challenges" @default.
- W2796156700 cites W1888223820 @default.
- W2796156700 cites W1964343985 @default.
- W2796156700 cites W1966143774 @default.
- W2796156700 cites W1971317760 @default.
- W2796156700 cites W1990324211 @default.
- W2796156700 cites W1998692332 @default.
- W2796156700 cites W2018021390 @default.
- W2796156700 cites W2030287613 @default.
- W2796156700 cites W2067399754 @default.
- W2796156700 cites W2069622008 @default.
- W2796156700 cites W2078273541 @default.
- W2796156700 cites W2078492284 @default.
- W2796156700 cites W2081739945 @default.
- W2796156700 cites W2085064025 @default.
- W2796156700 cites W2106864036 @default.
- W2796156700 cites W2131875329 @default.
- W2796156700 cites W2164381108 @default.
- W2796156700 cites W2317953216 @default.
- W2796156700 cites W2320211765 @default.
- W2796156700 cites W2344477413 @default.
- W2796156700 cites W2345249180 @default.
- W2796156700 cites W2509437229 @default.
- W2796156700 cites W2514307950 @default.
- W2796156700 cites W2519665632 @default.
- W2796156700 cites W2595276417 @default.
- W2796156700 cites W2625812646 @default.
- W2796156700 cites W2734584158 @default.
- W2796156700 cites W2744905935 @default.
- W2796156700 cites W912497526 @default.
- W2796156700 cites W949100985 @default.
- W2796156700 doi "https://doi.org/10.1109/tcpmt.2018.2810321" @default.
- W2796156700 hasPublicationYear "2018" @default.
- W2796156700 type Work @default.
- W2796156700 sameAs 2796156700 @default.
- W2796156700 citedByCount "16" @default.
- W2796156700 countsByYear W27961567002018 @default.
- W2796156700 countsByYear W27961567002019 @default.
- W2796156700 countsByYear W27961567002020 @default.
- W2796156700 countsByYear W27961567002021 @default.
- W2796156700 countsByYear W27961567002022 @default.
- W2796156700 countsByYear W27961567002023 @default.
- W2796156700 crossrefType "journal-article" @default.
- W2796156700 hasAuthorship W2796156700A5051712390 @default.
- W2796156700 hasAuthorship W2796156700A5073310038 @default.
- W2796156700 hasAuthorship W2796156700A5080591280 @default.
- W2796156700 hasConcept C127413603 @default.
- W2796156700 hasConcept C200601418 @default.
- W2796156700 hasConcept C41008148 @default.
- W2796156700 hasConceptScore W2796156700C127413603 @default.
- W2796156700 hasConceptScore W2796156700C200601418 @default.
- W2796156700 hasConceptScore W2796156700C41008148 @default.
- W2796156700 hasIssue "5" @default.
- W2796156700 hasLocation W27961567001 @default.
- W2796156700 hasOpenAccess W2796156700 @default.
- W2796156700 hasPrimaryLocation W27961567001 @default.
- W2796156700 hasRelatedWork W2093578348 @default.
- W2796156700 hasRelatedWork W2350741829 @default.
- W2796156700 hasRelatedWork W2358668433 @default.
- W2796156700 hasRelatedWork W2376932109 @default.
- W2796156700 hasRelatedWork W2382290278 @default.
- W2796156700 hasRelatedWork W2390279801 @default.
- W2796156700 hasRelatedWork W2748952813 @default.
- W2796156700 hasRelatedWork W2766271392 @default.
- W2796156700 hasRelatedWork W2899084033 @default.
- W2796156700 hasRelatedWork W3004735627 @default.
- W2796156700 hasVolume "8" @default.
- W2796156700 isParatext "false" @default.
- W2796156700 isRetracted "false" @default.
- W2796156700 magId "2796156700" @default.
- W2796156700 workType "article" @default.