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- W2799002991 abstract "For a high-power device of hybrid electrical vehicles requiring high thermal reliability, the concept of low temperature sintering material composed of Ag coated Cu, Sn/Ag/Cu ternary solder and chemical components removing oxide on the surface of metal fillers was studied under a processing temperature of 240oC. Due to the limited thermal reliability of conventional Tin based solder systems, the high-power device applications with a good thermal performance have been hindered because these solder materials were possibly re-melted under extreme operating conditions. Isotropic conductive paste based on thermosetting resin was previously investigated. With increase of temperature during processing, the Sn/Ag/Cu ternary solder in low temperature sintering material was melted at the melting temperature (220oC) of solder, and then, Sn was reacted with the adjacent Cu particles, producing intermetallic compound such as Cu 6 Sn 5 or Cu 3 Sn. The metallic reaction between Tin and copper increased the melting temperature of the yielded metal filler from 220oC to 360oC. Therefore, we expect the enhanced reliability and thermal stability of low temperature sintering material, compared to the solder-based conventional conductive interconnection materials, because the created metal filler product (intermetallic compound) in low temperature sintering material after processing will not be re-melted at the similar operating temperature to the processing temperature, 240oC. After sintering processing of low temperature sintering material in present research, 3.7 wt.% of the residue chemicals was detected by TGA because most of chemical components was evaporated during sintering process. In conclusion, low temperature sintering material is believed to be a good candidate material for the high-power device packaging due to the phenomena of the increased melting temperature of metal filler." @default.
- W2799002991 created "2018-05-07" @default.
- W2799002991 creator A5030565420 @default.
- W2799002991 creator A5050480058 @default.
- W2799002991 creator A5052810591 @default.
- W2799002991 creator A5054547127 @default.
- W2799002991 creator A5086512116 @default.
- W2799002991 date "2017-09-01" @default.
- W2799002991 modified "2023-09-26" @default.
- W2799002991 title "Low-temperature sintering behavior of ternary solder and copper powder for high-power device packaging" @default.
- W2799002991 cites W1977588922 @default.
- W2799002991 cites W1995427664 @default.
- W2799002991 cites W1998959460 @default.
- W2799002991 cites W2001055050 @default.
- W2799002991 cites W2082109271 @default.
- W2799002991 cites W2106623739 @default.
- W2799002991 doi "https://doi.org/10.23919/empc.2017.8346833" @default.
- W2799002991 hasPublicationYear "2017" @default.
- W2799002991 type Work @default.
- W2799002991 sameAs 2799002991 @default.
- W2799002991 citedByCount "0" @default.
- W2799002991 crossrefType "proceedings-article" @default.
- W2799002991 hasAuthorship W2799002991A5030565420 @default.
- W2799002991 hasAuthorship W2799002991A5050480058 @default.
- W2799002991 hasAuthorship W2799002991A5052810591 @default.
- W2799002991 hasAuthorship W2799002991A5054547127 @default.
- W2799002991 hasAuthorship W2799002991A5086512116 @default.
- W2799002991 hasConcept C159985019 @default.
- W2799002991 hasConcept C191281628 @default.
- W2799002991 hasConcept C191897082 @default.
- W2799002991 hasConcept C192562407 @default.
- W2799002991 hasConcept C27501479 @default.
- W2799002991 hasConcept C2777581544 @default.
- W2799002991 hasConcept C2780026712 @default.
- W2799002991 hasConcept C50296614 @default.
- W2799002991 hasConcept C544778455 @default.
- W2799002991 hasConceptScore W2799002991C159985019 @default.
- W2799002991 hasConceptScore W2799002991C191281628 @default.
- W2799002991 hasConceptScore W2799002991C191897082 @default.
- W2799002991 hasConceptScore W2799002991C192562407 @default.
- W2799002991 hasConceptScore W2799002991C27501479 @default.
- W2799002991 hasConceptScore W2799002991C2777581544 @default.
- W2799002991 hasConceptScore W2799002991C2780026712 @default.
- W2799002991 hasConceptScore W2799002991C50296614 @default.
- W2799002991 hasConceptScore W2799002991C544778455 @default.
- W2799002991 hasLocation W27990029911 @default.
- W2799002991 hasOpenAccess W2799002991 @default.
- W2799002991 hasPrimaryLocation W27990029911 @default.
- W2799002991 hasRelatedWork W1480083062 @default.
- W2799002991 hasRelatedWork W1548491387 @default.
- W2799002991 hasRelatedWork W2019417036 @default.
- W2799002991 hasRelatedWork W2043265992 @default.
- W2799002991 hasRelatedWork W2132758057 @default.
- W2799002991 hasRelatedWork W2390765072 @default.
- W2799002991 hasRelatedWork W2789877555 @default.
- W2799002991 hasRelatedWork W2797020891 @default.
- W2799002991 hasRelatedWork W3088881690 @default.
- W2799002991 hasRelatedWork W2750800037 @default.
- W2799002991 hasRelatedWork W2848474989 @default.
- W2799002991 hasRelatedWork W2852234318 @default.
- W2799002991 hasRelatedWork W2854230869 @default.
- W2799002991 hasRelatedWork W2855628058 @default.
- W2799002991 hasRelatedWork W2858280071 @default.
- W2799002991 hasRelatedWork W2867307939 @default.
- W2799002991 hasRelatedWork W2940515034 @default.
- W2799002991 hasRelatedWork W2959526287 @default.
- W2799002991 hasRelatedWork W2987539244 @default.
- W2799002991 hasRelatedWork W3114773575 @default.
- W2799002991 isParatext "false" @default.
- W2799002991 isRetracted "false" @default.
- W2799002991 magId "2799002991" @default.
- W2799002991 workType "article" @default.