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• W2799231796 abstract "Recent developments in the field of neuroprosthetics have created a demand for cost-effective advanced bonding techniques to mount polymer-based, thin-film, multi-electrode arrays onto PCBs. Low thicknesses of polymer substrates present challenges for common packaging technologies. Here we implemented a cost-effective direct bonding process of polyimide thin-film electrode arrays using vapor phase soldering. Our polymer foil is composed of PI-2611 and contains embedded gold/platinum/chromium traces. Contact pads are platinum coated and no under bump metallization is required. Instead of using wire bonding techniques, the contact pads are flip-chip bonded directly onto the PCB using a lead free solder paste. Transfer of the foil is carried out by vacuum placement. Soldering is subsequently performed in a vapor phase soldering oven. In contrast to wire bonding on flexible substrate materials, vapor phase soldering results in enhanced contact yield of approximately 99%. The landing area of the thin-film electrode, containing the soldered contact pads, is then passivated with a low-shrinkage epoxy in a pin-transfer process. Using such a low-shrinkage material is paramount to achieve sufficient long-term stability of the solder connections and to stabilize the thin polyimide substrate." @default.
• W2799231796 created "2018-05-07" @default.
• W2799231796 creator A5042623435 @default.
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• W2799231796 date "2017-09-01" @default.
• W2799231796 modified "2023-09-26" @default.
• W2799231796 title "Polyimide foil flip-chip direct bonding" @default.
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• W2799231796 doi "https://doi.org/10.23919/empc.2017.8346897" @default.
• W2799231796 hasPublicationYear "2017" @default.
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