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- W2800529857 abstract "The research on the lead-free solder materials has been a hot topic in electronic packaging industry. Among the lead-free solder materials, Sn–Ag–Cu alloys is potential substitutes for conventional Sn–37Pb solder. The alloys have advantages of good wetting property, superior interfacial properties and high creep resistance. In this article, the organization and welding performance of Sn–Ag–Cu Material were investigated. The experimental results showed that the microstructure of Sn–Cu solder contained a large number of Cu6Sn5 phase, while the main phase in Sn–Ag–Cu alloys was Ag3Sn intermetallic compound which was floc and β-Sn primary crystals, but no Cu6Sn5 phase existed." @default.
- W2800529857 created "2018-05-17" @default.
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- W2800529857 date "2018-01-01" @default.
- W2800529857 modified "2023-09-27" @default.
- W2800529857 title "Microstructure and Welding Performance of Sn–Ag–Cu Material" @default.
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- W2800529857 doi "https://doi.org/10.1007/978-981-13-0107-0_2" @default.
- W2800529857 hasPublicationYear "2018" @default.
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