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- W2800550718 abstract "This paper presents a high performance inertial sensor manufacturing process on 200mm wafers, adapted for applications in the industrial, aerospace, naval, offshore and defense markets. Electrical results for resonant frequency, frequency splits and quality factor are presented to demonstrate the process performance. The process integrates hermetic Wafer Level Packaging (WLP) without requiring a getter." @default.
- W2800550718 created "2018-05-17" @default.
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- W2800550718 date "2018-03-01" @default.
- W2800550718 modified "2023-09-24" @default.
- W2800550718 title "200mm High performance inertial sensor manufacturing process" @default.
- W2800550718 cites W1972951425 @default.
- W2800550718 doi "https://doi.org/10.1109/isiss.2018.8358158" @default.
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