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- W2801062077 abstract "Packaging for MEMS (microelectromechanical systems) is attracting increased interest because it is being recognized as an essential technique for successful commercialization of MEMS product. Similar to integrated circuit (IC) packaging in microelectronics, packaging of MEMS bears the highest cost within the whole manufacturing processes." @default.
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- W2801062077 date "2018-01-01" @default.
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- W2801062077 title "Overview of MEMS Packaging Technologies" @default.
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- W2801062077 doi "https://doi.org/10.1007/978-3-319-77872-3_1" @default.
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