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- W2801232011 abstract "This study investigated the effects of the post annealing temperatures on the electrical and interfacial properties of a metal-semiconductor-metal photodetector(MSM-PD) device. The interdigitate type MSM-PD devices had the structure Al(500 nm) / Ti(200 nm) / poly-Si(500 nm). Structural analyses of the MSM-PD devices were performed by employing X-ray diffraction(XRD), scanning electron microscopy(SEM) and transmission electron microscope(TEM). Electrical characteristics of the MSM-PD were also examined using current-voltage(I-V) measurements. The optimal post annealing condition for the Schottky contact of MSM-PD devices are 350°C-30minutes. However, as the annealing temperature and time are increased, electrical characteristics of MSM-PD device are degraded. Especially, for the annealing conditions of 400°C-180minutes and 500°C-30minutes, the I-V measurement itself was impossible. These results are closely related to the solid phase reactions at the interface of MSM-PD device, which result in the formation of intermetallic compounds such as Al3Ti and Ti7Al5Si12." @default.
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- W2801232011 date "2018-04-01" @default.
- W2801232011 modified "2023-09-25" @default.
- W2801232011 title "Post Annealing Effects on the Electrical Properties of Polysilicon Metal-Semiconductor-Metal Photodetectors" @default.
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- W2801232011 doi "https://doi.org/10.3740/mrsk.2018.28.4.195" @default.
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