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- W2807170259 abstract "In this paper, a new repair scheme which consists of a new repair algorithm and a base die structure of TSV based 3D memory is proposed. The traditional repair process in 3D memory uses extra cells in each memory layer. This paper proposes a new redundancy cell structure for repairing memory layers using spare cells on the base die which consists of solution memory, spare CAM and a control structure. The experimental results show that the repair rate of the new repair scheme is better than that of the inter-die method." @default.
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- W2807170259 date "2017-11-01" @default.
- W2807170259 modified "2023-09-27" @default.
- W2807170259 title "A new repair scheme for TSV-based 3D memory using base die repair cells" @default.
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- W2807170259 doi "https://doi.org/10.1109/isocc.2017.8368804" @default.
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