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• W2808074122 abstract "In the study, bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire were investigated. It was found that Ti (0.05%wt) and Y (0.05%wt) doped in the Ag-4.5%Pd alloy bonding wire could form substitutional solid solution with Ag, those did not cause golf ball defects. Minute quantities Ti and Y can refine the grain size, form uniform structure, improve the mechanical properties and bonded strength, and the reliability was improved. After PCT test, cracks were not found in the bonding interface, the ball shear strength and ball pull force of silver alloy wire decreased, and the reliability is better after doping some Ti and Y." @default.
• W2808074122 created "2018-06-21" @default.
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• W2808074122 date "2018-04-01" @default.
• W2808074122 modified "2023-09-25" @default.
• W2808074122 title "Bonded strength and reliability under high temperature and humid environment for silver alloy bonding wire" @default.
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• W2808074122 doi "https://doi.org/10.23919/icep.2018.8374319" @default.
• W2808074122 hasPublicationYear "2018" @default.
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