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- W2808132014 abstract "As the opportunities for the need of electronics to work reliably and safely in automotive environments continue to develop and become more important within a wide variety of market applications, the role of test and inspection to probe the quality of these new devices before active use becomes ever more important. For automotive environment applications there is a need to inspect non-destructively for the presence of voids, whether that be within a package, on the board or at other interfacial bonding layers. This is because thermal and power performance may be compromised if voids occur and voiding may be a key identifier for the subsequent strength and stability of these devices and their ultimate performance. The use of X-ray technology to investigate electronics used in automotive environments allows true non-destructive analysis for the presence of voiding. This often enables the root cause of issues to be quickly investigated without the need to cut or destroy the sample, an act which may otherwise potentially mask the real situation. The presence, quantity and location of voids can be clearly seen and measured in the X-ray results. This paper will explain the recent developments that have been made in 2D, 2.5D and 3D X-ray inspection and how they can be applied to electronics for automotive environments. The developments to be discussed will include the use of partial computer tomography (PCT), sometimes also called laminography, as well as the use of new ‘full CT’ algorithms, such as helical CT, which improve the clarity of the necessary analysis and clearly locate the source of potential voiding problems." @default.
- W2808132014 created "2018-06-21" @default.
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- W2808132014 date "2018-04-01" @default.
- W2808132014 modified "2023-09-24" @default.
- W2808132014 title "What 2D and 3D (CT) X-ray inspection now provides for electronics in automotive environments" @default.
- W2808132014 doi "https://doi.org/10.23919/icep.2018.8374352" @default.
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