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• W2809146423 abstract "Au thin films of thicknesses ranging from 5 to 20 nm were grown in UHV through physical vapour deposition on glass substrates decorated with Pt interdigitated electrodes with 5 μm separation. As expected, a gradual decrease in the electrical resistance of the films was observed as growth proceeded; however, when the average film thickness was greater than around 11 nm, the resistance decrease was not smooth but occurred in discrete steps. These resistance steps are attributed to the formation of electrical percolation pathways connecting the electrodes. The samples were then annealed at temperatures between 200 °C and 500 °C for periods of 1 to 22 h with the aim of producing insulating nanoparticle films. Dewetting of the Au films produces nanoparticles whose size and separation depend on annealing temperature and time, as well as the initial thickness of the Au film. The complex electrical resistance behaviour of the film was also monitored during the dewetting process." @default.
• W2809146423 created "2018-06-29" @default.
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• W2809146423 date "2018-06-18" @default.
• W2809146423 modified "2023-10-18" @default.
• W2809146423 title "Electrical percolation through a discontinuous Au nanoparticle film" @default.
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• W2809146423 doi "https://doi.org/10.1063/1.5023163" @default.
• W2809146423 hasPublicationYear "2018" @default.
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