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- W2883291483 abstract "The thin adhesive layer between the parent structure and the patch in adhesive bonding is theweakest link where interface delamination occurs. This interface delamination exhibits a mixedmode in nature due to the orthotropic behavior of composite and stepped con�guration of joint. Foranalysis of mixed-mode interface delamination in the single stepped scarf joint, Benzeggagh-Kenanemodel[1] has used. Under static loading, the result shows that the corners of the steps are in thehigh-stress concentration zone. And the delamination starts from the tip of the step in a symmetricmanner (from the �rst and the last step) and then propagates to the middle of the joint. Thetensile strength, peel stress, and shear stress distribution were investigated numerically concerningparameters such as some steps, scarf angle change on varying step length and step height and theadhesive bond line thickness. The results show that on increasing the number of steps and scarfangle by changing step length, the tensile strength of joint increases. And note the signi�cant e�ecton the tensile strength with varying step height and bond line thickness. So better design of thestepped lap joint in the composite structure increases the performance of the joint." @default.
- W2883291483 created "2018-08-03" @default.
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- W2883291483 date "2018-01-01" @default.
- W2883291483 modified "2023-09-23" @default.
- W2883291483 title "Interface delamination in stepped lap repairedCFRP panel under tensile loading" @default.
- W2883291483 hasPublicationYear "2018" @default.
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