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- W2884060426 abstract "In this study, the thermal buckling behavior of plain woven C/SiC composite plate is investigated by a noncontact measurement based on the three-dimensional digital image correlation (DIC) technique and finite element analysis. The plain woven C/SiC composite plate is fixed by a water-cooling steel frame and one-side heated by quartz lamp array heating apparatus. The buckling temperature and the first buckling mode shape of the C/SiC composite plate are determined from the temperature-displacement curves and full-field deformation that are obtained from the DIC-based experiment. A nonlinear finite element buckling analysis with initial imperfection is performed using the ANSYS software. In order to improve the accuracy of the numerical simulation, a clamping frame model is further proposed for simulating the real clamping boundary in experiment. The results of the finite element simulation and DIC-based measurement coincide well regarding the temperature-displacement curve tendency and critical buckling temperature. Finally, a parametric study is performed using the presented numerical model to investigate the thermal buckling behavior of plain woven C/SiC composite plates with various dimension sizes." @default.
- W2884060426 created "2018-08-03" @default.
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- W2884060426 date "2018-10-01" @default.
- W2884060426 modified "2023-10-17" @default.
- W2884060426 title "Study of thermal buckling behavior of plain woven C/SiC composite plate using digital image correlation technique and finite element simulation" @default.
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- W2884060426 doi "https://doi.org/10.1016/j.tws.2018.07.023" @default.
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