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- W2885525668 abstract "We have developed a semiconductor manufacturing system integrating a wafer process and a packaging process by using a half-inch sized package. The developed packaging tools are compatible with the tool-standard of Minimal Fab that we have already developed for half-inch wafer process. We have also developed a model process of a BGA package using the integrated system. We confirmed that MOSFET devices packaged in the BGA package worked electrically." @default.
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- W2885525668 date "2018-03-01" @default.
- W2885525668 modified "2023-09-26" @default.
- W2885525668 title "Development of Semiconductor Manufacturing System Integrating Wafer Process and Packaging Process Using a Half-Inch Sized Package" @default.
- W2885525668 doi "https://doi.org/10.1109/edtm.2018.8421441" @default.
- W2885525668 hasPublicationYear "2018" @default.
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