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- W2887379108 abstract "ABSTRACT With the rapid development of electronic industry, thermal management has become a critical issue that severely restricts the application of portable devices. In this work, we fabricate a flexible and free‐standing graphitized‐graphene/polyimide (I‐g‐GO/PI) film via an in‐situ “molecular welding” strategy. With the help of in‐situ polymerization, PI can be well‐dispersed with GO and serves as a solder to enlarge the grain size of GO, resulting in an enhanced thermal conductivity of the film. The 7 wt % addition of PI into GO (I‐g‐GO/PI‐7%) leads to an in‐plane thermal conductivity as high as 1269.700 ± 1.498 W/m/K, which is 81.8% higher than that of the pristine graphene and also superior to that fabricated via solution blending method by 58.3%. Simultaneously, the hybrid film exhibits an excellent flexibility and survives from a 2000 cycles bending test. The large‐area hybrid film prepared by such an in‐situ “molecular welding” method provides a promising way to fabricate graphene‐based film for highly efficient thermal management. © 2018 Wiley Periodicals, Inc. J. Polym. Sci., Part B: Polym. Phys. 2018 , 56 , 1215–1223" @default.
- W2887379108 created "2018-08-22" @default.
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- W2887379108 date "2018-08-07" @default.
- W2887379108 modified "2023-10-14" @default.
- W2887379108 title "<i>In-Situ</i> “molecular welding” preparation of graphene/polyimide hybrid film with superior thermal conductivity and flexibility" @default.
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- W2887379108 doi "https://doi.org/10.1002/polb.24640" @default.
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