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• W2887792782 abstract "Integration of III–V materials with silicon photonics using bonding allows the addition of lasers and optical amplifiers to this platform, which are critical elements in most photonic integrated circuit applications. The bonding approach allows integration of a wide range of materials with silicon and is compatible with high-volume wafer-scale production in sophisticated silicon fabrication facilities. Alternatively, the addition of the superior silicon waveguide to III–V laser devices enables better performance in narrow-linewidth single-wavelength and mode-locked lasers. This chapter will provide an introduction to the technology, the basic elements of the fabrication process for a heterogeneous laser, and then follow with technological demonstrations of these devices." @default.
• W2887792782 created "2018-08-22" @default.
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• W2887792782 date "2018-01-01" @default.
• W2887792782 modified "2023-09-25" @default.
• W2887792782 title "Heterogeneous Integration of III–V Lasers on Si by Bonding" @default.
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• W2887792782 doi "https://doi.org/10.1016/bs.semsem.2018.07.001" @default.
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