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- W2888272729 abstract "The evolution process of Kirkendall voiding was investigated by employing pure Sn solder and Cu films electroplated with a low current density. It is found that the Kirkendall voids (KVs) did not form until a certain period after the formation of Cu3Sn layer. The period length is determined by the holding temperature. Moreover, after growing to a high density, the KV-density decreased obviously. Therefore, the voiding process includes three stages, namely, incubation, formation/growth, and healing, under a low impurity level condition. Low level impurities prolong the incubation period of KVs, which is also largely determined by the temperature. The incubation stage of KV as aged at 150 °C is much longer than that aged at 180 °C. At low impurity level, the KV evolution accesses the healing stage instead of cracks and openings, which can be explained by the accelerated decline rate of JCu compared to JSn when the IMC layer grows thicker." @default.
- W2888272729 created "2018-08-31" @default.
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- W2888272729 date "2018-08-26" @default.
- W2888272729 modified "2023-09-29" @default.
- W2888272729 title "Evolution Modes and Self-healing Phenomenon of Kirkendall Voids at the Sn/Cu Solder Joints" @default.
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- W2888272729 doi "https://doi.org/10.1007/978-981-10-8740-0_8" @default.
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